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[0/2] support device private dump

Message ID 20221205081051.25905-1-fengchengwen@huawei.com (mailing list archive)
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fengchengwen Dec. 5, 2022, 8:10 a.m. UTC 
  This patchset adds device private dump for bonding PMD.

Chengwen Feng (2):
  net/bonding: support private dump ops
  net/bonding: support dump LACP info

 drivers/net/bonding/rte_eth_bond_pmd.c | 242 ++++++++++++++++++++++++-
 1 file changed, 241 insertions(+), 1 deletion(-)